MES2024 34th Microelectronics Symposium Invitation to Exhibit at Corporate Booths

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

This is a notice for the rebroadcast of the co-hosted seminar with Live Consulting Co., Ltd. held on September 11 and 15, 2026. "The New AI Tools Are No Longer Needed" This seminar allows participants to experience Microsoft Copilot, which can be used directly within familiar Word, Excel, and Teams, through a demonstration of actual operating screens. The answers are already within your existing Microsoft 365. You can use AI directly in Word, Excel, and Teams without the need for additional tool selection, all within the security framework of M365. We will explain the basics to practical applications of Copilot in 90 minutes, aimed at executives and managers in the manufacturing industry. We sincerely look forward to your participation. 【Recommended for】 - Executives and managers in the manufacturing industry who have not yet mastered generative AI/Copilot - Those considering AI implementation but are stalled due to tool selection, security, or promotion systems - Those who prefer to see "actual screens" rather than just "reading" before making a decision - Those who are concerned about security and cannot use ChatGPT in their company

We will be exhibiting at "CEATEC 2026," which will be held at Makuhari Messe from October 13 to 16. We provide information technology and process informatics (PI) that optimize "how to create" using physical simulations, AI, and machine learning in process development. We look forward to your visit to our booth. 【Seminar Information】 "Process Informatics for Exploring Optimal Manufacturing Conditions" Date and Time: October 16, 2026 (Friday) 12:45 - 13:00 Venue: Makuhari Messe Exhibition Hall 4 P Stage Speaker: CEO Takaishi Please check the link below for details on our exhibition.

In recent years, weather risks that affect construction sites, such as localized heavy rain, strong winds, and extreme heat, have been increasing. In response to this situation, more companies are implementing weather information services at the company or branch level to manage weather risks across multiple sites collectively. On the other hand, is there a challenge where "the company checks weather information, but it is not used much on-site"? To implement weather measures across the entire company, it is important not only for managers to easily grasp multiple sites but also for the personnel working on-site to be able to easily check the information necessary for their specific site. We are releasing a new feature called "Field View." For more details, please visit our website.

In recent years, weather risks such as localized heavy rain, strong winds, and extreme heat that affect construction sites have been increasing. In response to this situation, more companies are adopting weather information services at the company or branch level to manage weather risks across multiple sites collectively. On the other hand, is there a challenge where "the company checks weather information, but it is not used much on-site"? To implement weather measures across the entire company, it is important not only for managers to easily grasp multiple sites but also for the personnel working on-site to be able to easily check the information necessary for their specific site. We are releasing a new feature called "Field View." For more details, please visit our website.

In recent years, weather risks such as localized heavy rain, strong winds, and extreme heat that affect construction sites have been increasing. In response to this situation, more companies are introducing weather information services at the company or branch level to collectively manage weather risks across multiple sites. On the other hand, is there a challenge where "the company checks weather information, but it is not used much on-site"? To implement weather measures across the entire company, it is important not only for managers to easily grasp multiple sites but also for the personnel actually working on-site to be able to easily check the information necessary for their specific site. We are releasing a new feature called "Field View." For more details, please visit our website.