Thank you for visiting the Electronics Equipment Total Solution Exhibition 2024 (JPCA Show 2024) / JISSO PROTEC 2024.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We have won the 20th "JPCA Award"!

Takaya Corporation (Headquarters: Ihara-cho, Ihara City, Okayama Prefecture; President: Ryuji Okamoto) has received the 20th "JPCA Award" (hereinafter referred to as "the Award") for its "Hybrid Inspection System Combining JTAG Testing and Flying Probe Testing." The awarded "Hybrid Inspection System Combining JTAG Testing and Flying Probe Testing" integrates the flying probe tester with JTAG boundary scan testing, allowing for the mutual complementarity of each inspection method. This maximizes the test coverage of high-density mounted circuit boards and enables more accurate fault diagnosis, introducing a new system. A panel introducing the Award will be displayed at the "JPCA Show 2024 (Total Solutions for Electronic Devices Exhibition 2024)" held at Tokyo Big Sight from June 12 (Wednesday) to June 14 (Friday). Our company will also have an exhibition booth at the event, showcasing a live demonstration of the flying probe tester. We invite you to come and see it.

• Measurement and Inspection

Thank you for visiting the Total Solution Exhibition for Electronic Devices 2024 / JISSO PROTEC 2024.

Thank you to everyone who visited the Takaya Corporation booth at the "Electronic Equipment Total Solution Exhibition 2024 (JPCA Show 2024) / JISSO PROTEC 2024" held at Tokyo Big Sight from June 12 to June 14, 2024. We have published information about the products we exhibited. If you have any questions or inquiries regarding the content, please feel free to contact us. Additionally, in conjunction with this exhibition, we received the 20th "JPCA Award" for our "Hybrid Inspection System combining JTAG testing and flying probe testers," and an introduction panel regarding this award was displayed at the venue.

• Measurement and Inspection

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily visible at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

The signing methods for electronic contracts (party type and witness type) are directly linked to the strength of their legal effectiveness. In this article, we will outline the reasons why the more stringent "party type" has been difficult to popularize until now. ---【Conclusion of this article】-------------------------------- • There are two signing methods for electronic contracts: "witness type" and "party type," which differ in the strictness of identity verification. • The main reasons why the party type has not spread are the three factors of "effort, cost, and the structural risk of entrusting a private key." • However, with the spread of public personal authentication (JPKI) using My Number cards, these three barriers are beginning to crumble. -------------------------------------------------------- The full text of the article can be accessed from the "Related Links."

Seven Corporation has started offering the "SeveNavi AI Cleaning Diagnosis Service," which supports the organization and improvement of cleaning challenges in manufacturing environments. Organizing cleaning challenges with AI and visualizing the next steps In manufacturing cleaning, various factors need to be considered, including the material of the object, type of dirt, adhesion state, currently used cleaning agents, working time, safety, and equipment conditions. On the other hand, there are also several challenges faced on-site, such as: - Unable to determine if the current cleaning method is appropriate - Wanting to reduce cleaning time and labor - Concerns about the safety of cleaning agents and their impact on materials - Wanting to compare with another cleaning method but unable to set test conditions - Not being able to utilize past cases and knowledge for improvement activities SeveNavi organizes information such as the object, dirt, current cleaning methods, and site photos using AI, clearly presenting the applicability of cleaning methods, points of caution, missing information, and how to proceed with comparative testing. If you have any challenges regarding reviewing current cleaning methods, comparing new cleaning methods, or reducing cleaning time and labor, please feel free to consult with us.

An online seminar will be held for design, purchasing, and DX promotion personnel considering the introduction or switch to new CAD systems, featuring the DWG-compatible 2D CAD "ARES." Participants can review content directly related to business improvement, including a comparison of features and performance with AutoCAD, automation using the CAD-specific AI "A3," automatic generation of DWG drawings from BIM data, and new ways of working in the cloud. ■ Date and Time: September 17, 2026 (Thursday) 13:30 - 15:00 ■ Format: Online (with archive viewing available) ■ Participation Fee: Free ■ Recommended for: - Those considering switching from AutoCAD - Those interested in AI utilization and automation in CAD operations - Those looking to streamline collaboration with BIM - Those seeking an environment where drawings can be edited regardless of location As a viewing benefit, a free "ARES Trinity Utilization Manual" (worth 6,000 yen) will be provided. Additionally, if you apply through the URL in the related links, our company, Keynos Logic, will consistently support you from post-seminar implementation considerations to estimates and support after operation begins. If you are interested in ARES, feel free to start by participating in this seminar.

On August 28, 2026 (Friday), I participated in the "AMD Embedded Computing Summit Tokyo 2026" and showcased a "Gesture Demo" as a partner of AMD. The demonstration introduced a configuration that combines gesture recognition using OpenCV, status reporting with LLM, and one-axis motor control using INtime 7.2 and RSI-ECAT, enabling collaboration between AI, image processing, and real-time control on a single PC. We presented a next-generation PC-based industrial control system that integrates AI, image processing, and real-time control on one PC. <Overview of Demo Participation> https://www.mnc.co.jp/INtime/AMDxINtime/AMDEcsTokyoResults.html <Actual Demo Video> https://youtu.be/JmZke75_y0s <AMD CPU + INtime RTOS Introduction Page> https://www.mnc.co.jp/INtime/AMDxINtime/amdxintime.html #PC #RealTimeOS #IndustrialPC #AI