Yamazen [June 19 (Wednesday) - June 21 (Friday), 2024] Notice of Participation in the 36th Monozukuri World Tokyo

Achieving automation of visual inspection! Image inspection system 'EYEbeGenesis' equipped with third-generation AI.

"EYEbeGenesis" is an AI image inspection system equipped with the latest third-generation AI. <Features of Third-Generation AI> Previous AI image inspection devices required a vast amount of images to be memorized due to algorithm-based judgments. However, EYEbeGenesis, equipped with third-generation AI, enables inspections that are closer to the human eye with minimal information by incorporating a unique image "augmentation feature" that was not possible with algorithms. <Package Features> To facilitate easy implementation, we have bundled the main PC, software, and essential peripherals into one package. By using versatile equipment for system configuration, it can be introduced at a lower cost and more easily than conventional products. ■ Equipped with third-generation AI ■ Constructed with minimal information ■ Capable of detection even when target work overlaps or contacts ■ Diverse inspection applications ■ Low-cost and speedy implementation possible ■ All-in-one package *For more details, please refer to the PDF document or feel free to contact us.

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Achieving automation of visual inspection! An AI image inspection device that can be introduced at low cost, easily, and quickly, now equipped with shape detection AI for dimensional judgment.

"EYEbeGenesis+" is an AI image inspection device equipped with third-generation AI and shape inspection AI. <Equipped with shape inspection AI, enabling dimension judgment that was not possible with conventional products> It can recognize size differences that were difficult for conventional products. It has become possible to distinguish between works with the same shape but different dimensions. <Equipped with third-generation AI, making learning easy> Previously, it was necessary to prepare a vast number of images for the AI to learn, but with the augmentation feature of third-generation AI, it can be built with less information. It can detect even when there is contact or overlap between target works. 【Features】 ■ Equipped with third-generation AI, allowing AI construction with minimal information ■ PC body, software, and essential peripherals packaged together ■ Low cost and speedy implementation ■ Equipped with shape detection AI, enabling dimension judgment *For more details, please refer to the PDF document or feel free to contact us.

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!