Started selling "ToffeeX," which supports the development and design of cooling structural components - Achieving reduced development time and improved product performance through thermal fluid analysis and topology optimization.

SCSK Corporation (Headquarters: Koto-ku, Tokyo, Representative Director, Executive Officer President: Takashi Toma, hereinafter referred to as SCSK) has concluded a general agency agreement for the sales of the cloud-based topology optimization software "ToffeeX" with ToffeeX Ltd (Headquarters: London, UK) and will begin sales on April 1, 2024. By utilizing advanced topology optimization technology, we will derive component shapes that maximize heat dissipation and minimize pressure loss in a short time, thereby achieving reduced development time and improved product performance. We aim to sell 50 units by March 2026, focusing on the manufacturing of components that require thermal management and the product design field using 3D printing.
*1 Analysis that clarifies how to optimally arrange materials within the design space to achieve the best structure.
*2 The energy lost by fluids as they pass through pipes and other conduits.

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ToffeeX is a topology optimization software based on fluid analysis, featuring high-speed computation, multi-objective optimization, and an intuitive GUI/cloud service (SaaS) as its characteristics.