[May 24, 2024 (Friday) 10:30-16:30] Announcement of the Adhesive and Bonding Technology Exhibition 2023

【Exhibition】
Exhibition Information: Adhesive and Bonding Technology Exhibition 2024
Osaka Industry Creation Center, 3F・4F *Reception on 4F
1-4-5 Honmachi, Chuo-ku, Osaka 541-0053
【Target Audience】
Companies looking for distinctive adhesives, products, and related technologies
Companies searching for adhesives
【Date and Time】
May 24, 2024 (Friday) 13:30 - 16:30, divided into 3 sessions
【Transportation】
Get off at Osaka Metro "Sakaisuji-Honmachi Station"
Approximately 5 minutes on foot from Exit 1 of the "Chuo Line" and Exit 12 of the "Sakaisuji Line"
【Exhibition Content Description】
Integrated molding of insulation, adhesion, and weight reduction using polyurethane
【Exhibits】
Rigid polyurethane molded products
High-end insulated bath lids
Refrigerated boxes
Vacuum insulation material encapsulated panels
Insulated resin tanks

Date and time | Friday, May 24, 2024 10:30 AM ~ 04:30 PM *Completely by reservation only. 10:30 AM to 4:30 PM, divided into three sessions.* |
---|---|
Capital | 【Exhibition】 Exhibition Information: Adhesive and Bonding Technology Exhibition 2024 Osaka Industry Creation Center, 3rd and 4th Floors *Reception on the 4th Floor 〒541-0053 1-4-5 Honmachi, Chuo Ward, Osaka City 【Transportation】 Get off at Osaka Metro "Sakaisuji-Honmachi Station" Chuo Line Exit 1, Sakaisuji Line Exit 12, each about a 5-minute walk |
Entry fee | Free |
Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration