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  3. エクシール 本社
  4. We will be exhibiting at "SEMICON Japan 2023."
SEMINAR_EVENT
  • Dec 04, 2023
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Dec 04, 2023

We will be exhibiting at "SEMICON Japan 2023."

エクシール エクシール 本社
We will be exhibiting at "SEMICON Japan 2023," the only international exhibition for the electronics manufacturing supply chain, including manufacturing technologies, equipment, and materials in the semiconductor industry. At our booth, we will showcase products that are active in the semiconductor industry! You can actually see samples and try them out. ○ Perfect for holding and storing precision parts and chips! 'Completely silicone-free' siloxane-free precision parts transport case [Gel Base] 'Siloxane-free' semiconductor chip transport case [Gel Base V Type] ○ For dust removal from printed circuit boards and devices, and picking up small parts! 'Reusable with water washing' foreign matter collection adhesive pen [Gel Cleaner Pen] ○ Ideal for removing fine dust from fingertips! Reusable with water washing! 'Non-silicone specification & no plasticizers' adhesive gel for fingertips [Tip Remover] We sincerely look forward to your visit. ★ Visit us here ★ SEMICON Japan 2023 ◎ Dates: December 13 (Wed) - December 15 (Fri), 2023, 10:00 AM - 5:00 PM ◎ Venue: Tokyo Big Sight (East Exhibition Hall) ◎ Booth Number: 2454
Gel-based image
Gel-based image
Semicon Japan Banner
Semicon Japan Banner
Date and time Wednesday, Dec 13, 2023 ~ Friday, Dec 15, 2023
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight (East Exhibition Hall) No. 2454
Entry fee Free
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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used safely as it is free of adhesives and silicone. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents electrostatic damage to components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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For cleaning the base! Gently removes dust from details with the 'Gel Cleaner Pen'

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dirt using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worries about glue transfer! Since it captures dirt with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind, without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and fits well with your fingers. Gently rubbing it with your palm under running water will remove dirt and restore its adhesive power. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove debris. It does not transfer glue to gloves and does not feel sticky. It can be installed in your preferred location, such as on a desk, wall, or ceiling, and can be removed as well. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash away dirt with water! Can be washed thoroughly! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner will also allow for disinfection. *For more details, please download and view the catalog.

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Silicone-free semiconductor chip transport case "Gel Base Type V"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the transportation of small parts such as semiconductor chips and precision devices within factories, during processes, and for overseas transport. During transportation, it protects precision parts from vibrations and also plays a significant role in securing devices like semiconductors. It can be used safely as it is free from adhesive materials and siloxanes. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ Non-silicone specification, so there is no influence from siloxanes! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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Related catalog(5)

Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Finger Adhesive Gel 'Tip Remover' Leaflet

Finger Adhesive Gel 'Tip Remover' Leaflet

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Vacuum Type Precision Parts Storage and Transport Case 'Gel Base V Type' Leaflet

Vacuum Type Precision Parts Storage and Transport Case 'Gel Base V Type' Leaflet

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エクシール
Building materials, supplies and fixtures manufacturers
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Automobile and Technology Exhibition 2026 YOKOHAMA

Notice of Participation in the 2026 Yokohama Automotive Technology Exhibition

  • NEW
  • SEMINAR_EVENT

Sekisui Filler Co., Ltd. will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Car Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coating agents - Optical adhesives We sincerely look forward to your visit.

May 15, 2026

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Notice of Participation in "AXIA EXPO 2026" from June 3 (Wednesday) to June 5 (Friday), 2026.

  • NEW
  • SEMINAR_EVENT

Palmholtz Co., Ltd. will be exhibiting at the "AXIA EXPO 2026" held at Aichi Sky Expo (Aichi Prefectural International Exhibition Center). Our company possesses unique new technologies that transform oil palm trunks (Oil Palm Trunk = OPT), which have been treated as unused resources due to their lack of strength and value as building materials, into wood-based products such as building materials and furniture. The oil palm, which produces a large amount of edible oil, leaves the trunks unused and discarded after the oil is extracted. It is estimated that the amount of discarded trunks is 20 million tons per year in both Malaysia and Indonesia. This project involves peeling and drying the unused oil palm trunks to create veneer, which is then layered and compressed under high temperature and pressure to manufacture and sell exterior materials. We showcased a bench as a reference exhibit at the Malaysia Pavilion during the 2025 Osaka Expo. We sincerely look forward to your visit.

May 15, 2026

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[5/20 Presentation] At the interim report meeting for the Tokyo Metropolitan Government's "Decarbonization Support Project in the Supply Chain for the Creation of a Green Product Market," a case study on the use of plastic formwork "Daiko Panel" was presented.

  • NEW
  • SEMINAR_EVENT

Kawasaki Corporation (Headquarters: Tokyo) is pleased to announce that it will participate in the interim report meeting for the Tokyo Metropolitan Government's "Decarbonization Support Project in the Supply Chain for the Creation of a Green Products Market," which will be held on May 20, 2026. At this meeting, we will present the CO2 reduction effects of our environmentally friendly plastic formwork "Daiko Panel," which we have conceived, developed, manufactured, and sold, along with our initiatives towards greening, including related auxiliary materials. [Overview of the Presentation] Theme: Utilizing CFP to enhance CO2 reduction of "Daiko Panel" and promote greening throughout the entire supply chain. Main Content: Introducing initiatives aimed at CO2 reduction, referencing the background of our application for this project and the CFP calculation results for "Daiko Panel" and its auxiliary materials. [Presentation Date and Time] Interim report meeting: May 20, 2026 (Wednesday) from 15:00 to 17:00 Details of the interim report meeting and the Tokyo Metropolitan Government's project: Decarbonization support in the supply chain for the creation of a green products market https://www.cfp-sc.metro.tokyo.lg.jp/

May 15, 2026

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Notice of Participation in the 8th International Construction and Surveying Exhibition (CSPI2026) from June 17 (Wednesday) to June 20 (Saturday), 2026.

  • NEW
  • SEMINAR_EVENT

Rentama Co., Ltd. will be exhibiting at the "8th International Construction and Surveying Exhibition (CSPI2026)" held at Makuhari Messe. A wide range of cutting-edge products, technologies, and services from the evolving industries of construction machinery, heavy equipment, attachments, construction DX, and i-Construction will be gathered in one place. This is one of the largest exhibitions in Japan for professionals in the construction and surveying industries to gather for business discussions, advanced information gathering, and problem-solving. This is a valuable opportunity to see KEMROC products up close. We understand you may be busy, but we invite you to stop by our booth. We look forward to meeting everyone.

May 15, 2026

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Notice of Participation in 'FOOMA JAPAN 2026' from June 2 (Tuesday) to June 5 (Friday), 2026.

  • NEW
  • SEMINAR_EVENT

TESSHA Corporation will be exhibiting at 'FOOMA JAPAN 2026' held at Tokyo Big Sight. This exhibition covers various fields of food manufacturing and is one of the largest comprehensive food manufacturing exhibitions in the world, where advanced technologies and knowledge come together. We plan to showcase our "Small Catalytic Deodorization Device SCU-1EH type." We look forward to your visit.

May 15, 2026

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