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  3. エクシール 本社
  4. We will be exhibiting at "SEMICON Japan 2023."
SEMINAR_EVENT
  • Dec 04, 2023
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Dec 04, 2023

We will be exhibiting at "SEMICON Japan 2023."

エクシール エクシール 本社
We will be exhibiting at "SEMICON Japan 2023," the only international exhibition for the electronics manufacturing supply chain, including manufacturing technologies, equipment, and materials in the semiconductor industry. At our booth, we will showcase products that are active in the semiconductor industry! You can actually see samples and try them out. ○ Perfect for holding and storing precision parts and chips! 'Completely silicone-free' siloxane-free precision parts transport case [Gel Base] 'Siloxane-free' semiconductor chip transport case [Gel Base V Type] ○ For dust removal from printed circuit boards and devices, and picking up small parts! 'Reusable with water washing' foreign matter collection adhesive pen [Gel Cleaner Pen] ○ Ideal for removing fine dust from fingertips! Reusable with water washing! 'Non-silicone specification & no plasticizers' adhesive gel for fingertips [Tip Remover] We sincerely look forward to your visit. ★ Visit us here ★ SEMICON Japan 2023 ◎ Dates: December 13 (Wed) - December 15 (Fri), 2023, 10:00 AM - 5:00 PM ◎ Venue: Tokyo Big Sight (East Exhibition Hall) ◎ Booth Number: 2454
Gel-based image
Gel-based image
Semicon Japan Banner
Semicon Japan Banner
Date and time Wednesday, Dec 13, 2023 ~ Friday, Dec 15, 2023
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight (East Exhibition Hall) No. 2454
Entry fee Free
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0130144559_6014f2977c255.jpg

Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used safely as it is free of adhesives and silicone. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents electrostatic damage to components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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For cleaning the base! Gently removes dust from details with the 'Gel Cleaner Pen'

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dirt using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worries about glue transfer! Since it captures dirt with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind, without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and fits well with your fingers. Gently rubbing it with your palm under running water will remove dirt and restore its adhesive power. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove debris. It does not transfer glue to gloves and does not feel sticky. It can be installed in your preferred location, such as on a desk, wall, or ceiling, and can be removed as well. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash away dirt with water! Can be washed thoroughly! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner will also allow for disinfection. *For more details, please download and view the catalog.

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DSC03218-3.jpg

Silicone-free semiconductor chip transport case "Gel Base Type V"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the transportation of small parts such as semiconductor chips and precision devices within factories, during processes, and for overseas transport. During transportation, it protects precision parts from vibrations and also plays a significant role in securing devices like semiconductors. It can be used safely as it is free from adhesive materials and siloxanes. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ Non-silicone specification, so there is no influence from siloxanes! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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Related catalog(5)

Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

PRODUCT
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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Finger Adhesive Gel 'Tip Remover' Leaflet

Finger Adhesive Gel 'Tip Remover' Leaflet

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Vacuum Type Precision Parts Storage and Transport Case 'Gel Base V Type' Leaflet

Vacuum Type Precision Parts Storage and Transport Case 'Gel Base V Type' Leaflet

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Building materials, supplies and fixtures manufacturers
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Inspiration from AI, proof by human hands. - Hypothesis generation that awakens 'dormant research seeds' and strategic clinical trials that enhance the efficiency of food development.

Inspiration from AI, proof in human hands. - Hypothesis generation that awakens 'dormant research seeds' and strategic clinical trials that enhance the efficiency of food development.

  • NEW
  • SEMINAR_EVENT

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Aug 08, 2025

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Announcement of the WEB seminar "Tips for Setting Laser Hardening Conditions" on August 20, 2025 (Wednesday).

  • SEMINAR_EVENT

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Aug 07, 2025

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[Fukuoka Event] Where to Start? DX Talent Development Support Seminar for Small and Medium Enterprises - Learning How to Implement DX through Case Studies and Experiences -

  • SEMINAR_EVENT

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

Aug 05, 2025

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INCHEM TOKYO 2025 Exhibition

  • SEMINAR_EVENT

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

Aug 05, 2025

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Siemens EDA Tech Forum 2025 Japan

  • SEMINAR_EVENT

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!

Aug 04, 2025

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  • イプロスがリアル展示会を主催します! AI/DX 営業・マーケティング展 出展社募集中 リード数・商談数が止まらない!新しいリアル展示会を提供 会期 2026年3月24日(火)~25日(水) 会場 東京ビッグサイト東4ホール 出展概要資料を進呈!
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