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  3. ケイエルブイ
  4. We will be exhibiting at the International Image Equipment Exhibition 2023.
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  • Oct 30, 2023
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Oct 30, 2023

We will be exhibiting at the International Image Equipment Exhibition 2023.

ケイエルブイ ケイエルブイ
We will be exhibiting at the International Image Equipment Exhibition 2023, which will be held at Pacifico Yokohama from December 6 (Wednesday) to December 8 (Friday), 2023.
Date and time Wednesday, Dec 06, 2023 ~ Friday, Dec 08, 2023
10:00 AM ~ 05:00 PM
Capital Pacifico Yokohama Exhibition Hall D
Entry fee Free Please register from the official exhibition website.
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Hyperspectral Camera Hyspex Classic

Corresponding to visible to near-infrared (up to 2500nm). A hyperspectral camera suitable for remote sensing, resource exploration, and research applications with high sensitivity and low noise.

The HySpex series hyperspectral cameras can be used for field, lab, and aerial system applications. ■ High S/N ratio ■ High spatial resolution and frame rate ■ Product lineup compatible with visible and near-infrared wavelength ranges (400–1000nm/930–2500nm/960–2500nm) ■ A wide range of accessories tailored to shooting conditions Suggestions available for aircraft, lab, and field systems (stages, navigation systems, dedicated tripods, etc.)

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High-Speed 3D Scanner_LOM-HighSpeed3D Sensor

Measurable at a maximum speed of 10 kHz. High-speed 3D scanner.

The LOM sensor series from Optomotive is a 3D profile scanner capable of scanning at a maximum speed of 10kHz. Thanks to Optomotive's unique optical design and blue laser, it can measure shiny and reflective objects, which are typically difficult to obtain 3D data from. - Utilizes high-speed industrial CMOS sensors - Capable of scanning at a maximum speed of 10kHz - Incorporates GigE Vision and GeniCam - Can accurately capture 3D profiles of reflective objects - Features a modular design

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3D camera system "Roboception RC_VISARD"

Ideal for machine vision. Plug & play high-precision 3D stereo camera system.

This is a high-precision 3D stereo camera system specialized for robot vision that can analyze and process data captured by the camera onboard without the need for external hardware. ■ 3D Stereo Camera: RC_VISARD - Baseline: 65mm, 160mm - Type: Color/Monochrome You can choose from a total of 4 types of cameras according to your application. - Real-time object analysis and processing - Usable indoors and outdoors - Low-noise depth images due to smoothing technology - High frame rate (1.2 Mpixel, 0.8Hz) - Capable of mounting a genuine white LED projector - Global shutter ■ Software/Application Module: RC_REASON - Various application modules are available (BoxPick, ItemPick, CAD Match, Silhouette Match) - By using the optimal module, it can be integrated into processes without complex image analysis or programming. - No need to use external hardware, directly collaborates with the robot - Modules are built into the camera, and the captured images can be processed onboard within the camera.

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3D Imaging System_Depth Scan

High-resolution, high-precision 3D imaging system

The 3D imaging system Depth Scan is a system capable of capturing high-resolution, high-precision 3D color images and videos at high speed. It is ideal for machine vision and measurement applications. 【Features】 - High precision (depth accuracy of less than 100μm) - High resolution (1824×2280 [4MP]) - Acquires color information (RGB) - High throughput (30Hz [low resolution], 2Hz [high resolution]) - Wide working distance (25~150cm) - Capable of outputting to 3D CAD

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Micro-optics equipped ultra-compact camera module

A very compact and highly sensitive industrial camera that demonstrates excellent performance when combined with optical devices and more! It can also be used as a standalone device!

■XS Series Ultra-small camera module Multi-element lens optimized for image quality and the best depth of field Standard and customized modules ■S Series Camera module designed to be optimized for small sensors. Can be used in low-light environments. ■M Series Minimum camera with Full HD or HD resolution. HQ lens with a very high depth of field from approximately 1mm to infinity. Exhibits excellent performance across a wide range without adjustment. ■L Series High resolution, high light sensitivity, and fast automatic adjustment make it suitable for various applications. Easily integrated into complex systems such as machinery, robotics, and automation systems. Can also be used in independent devices like digital microscopes, as well as for process control, assembly, and inspection. ■Smart Series Available in standard specifications Can be purchased at a low price with a short delivery time High-performance camera module Available in three models: ultra-small, S, M, and L

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micro_cams.jpg

Micro-optics equipped ultra-compact camera

A very compact and highly light-sensitive camera that demonstrates excellent performance when combined with optical devices and more! It can also be used as a standalone unit!

■XS Series The smallest ultra-compact size in the series Ф1.8×12mm~ ■S Series Camera module designed to be optimized for small sensors. Can be used in low-light environments. ■M Series The smallest camera with Full HD or HD resolution. HQ lens with a very high depth of field from approximately 1mm to infinity. Exhibits excellent performance across a wide range without adjustment. ■L Series Can be used in various applications due to high resolution, high light sensitivity, and fast automatic adjustment. Easily integrated into complex systems such as machines, robots, and automation systems. Also usable in independent devices like digital microscopes, as well as in process control, assembly, and inspection.

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Micro-optics equipped ultra-compact camera module [M Series]

Capable of video recording in ultra-small full HD resolution, a CMOS camera with a depth of field from 1mm to infinity.

■M Series The M series camera modules from the ultra-compact camera manufacturer Optikron are multifunctional, small, and can be embedded into devices/equipment. The M series is the smallest camera with either Full HD or HD resolution. It is chosen in the industrial field as the foundational camera for video systems. Notably, it features a high-quality lens with an extremely high depth of field ranging from approximately 1mm to infinity, providing excellent sharpness. The interfaces are USB and CVBS. It is equipped with a 1/8 size CMOS sensor, capable of capturing Full HD (1920×1080 pixels) video in this ultra-compact size.

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Video hyperspectral camera ULTRIS 5

【Suitable for OEM】Ultra-compact and low-cost. A hyperspectral camera capable of video recording.

【Minimum Size of Video Hyperspectral Camera UTLRIS】 - Ultra-compact: 29×29×49 mm - Ultra-lightweight (126 g) - Snapshot-type hyperspectral camera based on light field technology. - Capable of video recording - Covers a wavelength range of 450–850 nm (VNIR region) Suitable for OEM with 【Ultra-compact & Lightweight】 × 【Low Price】 - Opens up new hyperspectral imaging markets in various industrial fields such as food, industry, medical, and recycling. The ultra-compact and lightweight UTLRIS 5 is also suitable for use with UAS.

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imec Hyperspectral Camera SNAPSHOT SWIR

[Real-time Snapshot] Compact and lightweight (260g). 1100-1650nm. Capable of video recording.

The SNAPSHOT SWIR from imec is a compact and lightweight hyperspectral camera capable of real-time snapshot imaging at video rates. ■ Real-time snapshot-type hyperspectral camera ■ Capable of video recording ■ Maximum frame rate: 120 fps ■ Wavelength range: 1,100 to 1,650 nm ■ Compact size: 65×65×130 mm ■ Lightweight: 260 g Since it allows for hyperspectral video recording in snapshot mode, it is ideal for applications involving moving subjects (such as tissue observation in medical imaging, capturing moving targets for security and surveillance purposes, and inspection on conveyor belts).

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Cubert_Video Hyperspectral Camera ULTRIS X20

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The "Hyperspectral Camera ULTRIS X20" is an innovative hyperspectral camera based on light field technology. It is equipped with a 20MP CMOS sensor, allowing for high-resolution data acquisition. The "ULTRIS X20" has an expanded measurement wavelength range compared to the conventional model "ULTRIS 20," now covering a wide range of wavelengths from 350 to 1000 nm, from ultraviolet to near-infrared, all in one device. **Features of ULTRIS X20:** - Capable of capturing hyperspectral imaging data in video format - Measurement wavelength range: 350-1000 nm, 164 spectral bands - High resolution - 410×410 pixels - Compact (60 × 60 × 57 mm), lightweight (350 g) (standard model S20) - Robust housing compliant with IP standards - Capable of underwater shooting With its compact and lightweight design, it can be mounted on general drones. The 164 spectral bands and high spatial resolution of 410×410 pixels make it suitable for a wide range of applications, not only in laboratories and fieldwork but also in UAV applications.

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Hyperspectral Camera HAIP BlackMobile

Mobile-type hyperspectral camera that easily and quickly acquires VNIR (500-1000nm) spectral data on-site.

The HAIP BlackMobile hyperspectral camera is a handheld hyperspectral camera that allows for quick and easy acquisition of hyperspectral data in the field. ■ Mobile-type hyperspectral camera - Easy operation and result display in the field with a touch panel display. - Built-in LED lighting - Wavelength range: 500~1000nm, 100 spectral bands - High signal-to-noise ratio in the NIR region - Also equipped with a 4K RGB sensor

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Inspiration from AI, proof by human hands. - Hypothesis generation that awakens 'dormant research seeds' and strategic clinical trials that enhance the efficiency of food development.

Inspiration from AI, proof in human hands. - Hypothesis generation that awakens 'dormant research seeds' and strategic clinical trials that enhance the efficiency of food development.

  • NEW
  • SEMINAR_EVENT

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Aug 08, 2025

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Announcement of the WEB seminar "Tips for Setting Laser Hardening Conditions" on August 20, 2025 (Wednesday).

  • NEW
  • SEMINAR_EVENT

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Aug 07, 2025

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[Fukuoka Event] Where to Start? DX Talent Development Support Seminar for Small and Medium Enterprises - Learning How to Implement DX through Case Studies and Experiences -

  • UPDATE
  • SEMINAR_EVENT

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

Aug 05, 2025

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INCHEM TOKYO 2025 Exhibition

  • UPDATE
  • SEMINAR_EVENT

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

Aug 05, 2025

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Siemens EDA Tech Forum 2025 Japan

  • SEMINAR_EVENT

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!

Aug 04, 2025

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  • イプロスがリアル展示会を主催します! AI/DX 営業・マーケティング展 出展社募集中 リード数・商談数が止まらない!新しいリアル展示会を提供 会期 2026年3月24日(火)~25日(水) 会場 東京ビッグサイト東4ホール 出展概要資料を進呈!
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