Feature article: "Latest Trends in BGA Assembly Board Inspection - Hybrid Testing of Flying Probe Testers and JTAG Testing" has ranked in the overall ranking of the Manufacturing Catalog.

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

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We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

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This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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Japan is one of the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of major earthquakes occurring. Regarding the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake countermeasures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" For more details, please download the materials or contact us.

Do you have any concerns or requests regarding wired bed exit sensors? × Tangling or tripping over wired cables × Cable disconnection or damage × Worrying about forgetting to turn the switch back on after temporarily stopping the sensor. × Wanting to be notified of bed exits even from a location far from the nurse call outlet. Such concerns can be resolved simply by connecting our wireless nurse call linked set to the sensor! Our wireless nurse call linked set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed area, alleviating concerns about tripping or falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations far from the nurse call outlet, allowing for more flexible equipment placement.

Based on practical experience in support companies and business companies, SBS Marketing Co., Ltd. provides consulting services related to marketing, sales promotion, and customer acquisition primarily in the BtoB (business-to-business) sector. On June 4, 2026, we published a page titled "Do We Set 'Forecasts' Too Optimistically Compared to Reality? The 'Planning Fallacy'." The 'Planning Fallacy' refers to the psychological phenomenon of underestimating the time, costs, and risks involved in carrying out tasks while overestimating the benefits. The page explains examples of its occurrence, the factors that lead to it, and methods to overcome it. (Page Overview: Excerpts) ■ What is the 'Planning Fallacy'? ■ Examples of the 'Planning Fallacy' ■ Why does the 'Planning Fallacy' occur? ■ How to overcome the 'Planning Fallacy'? (DL content only) ▼ For more details, please visit this page. https://sbsmarketing.co.jp/blog/planning-fallacy-2026-06/

Kort Valuta has released a workplace initiative model that leverages points exchangeable for electronic money to support the adoption of safety and wellness habits. Examples include: ・Hydration reporting ・Viewing heatstroke prevention content ・Pre-shift condition checks ・Voice-based condition checks By linking these activities to incentive points, organizations can encourage voluntary participation while supporting workplace safety and employee well-being. The model is designed not only for frontline environments such as: ・Logistics ・Construction ・Manufacturing but also for office-based health and well-being programs. Safety posters and reminders alone are often not enough to drive lasting behavioral change. We hope this initiative provides a practical example for organizations seeking new approaches to workplace safety and employee engagement. Read the full press release: https://prtimes.jp/main/html/rd/p/000000118.000076589.html #HeatstrokePrevention #WorkplaceSafety #EmployeeWellbeing #HealthManagement #OccupationalHealth #HR #Logistics #Construction #Manufacturing #TwooCa

Our company will be presenting at the "On-Site Made Easy! Latest Technology Seminar Vol. 20" (organized by Shinken Shimbunsha)! Kinos Logic will be speaking in Session 3 (15:50 - 17:00). We will provide a clear explanation of the tool "Seigou Navi," which can streamline the review of civil engineering drawings on a PC, using real-life examples. ■ Event Overview Date and Time: June 30, 2026 (Friday) 13:00 - 17:00 *Entry starts at 12:30 Format: Zoom (online broadcast) Capacity: 300 participants for the Zoom live broadcast Participation Fee: Free (Note: Additional fees for continuing education unit application services, etc.) Application Deadline: June 26 (Friday) 17:00 Organizer: Shinken Shimbunsha