Notice of Participation in the 22nd Micro Machine/MEMS Exhibition

We are pleased to announce that we will be exhibiting at the 22nd Micro Machine/MEMS Exhibition.
Dates: July 13 (Wednesday) to July 15 (Friday), 2011
Venue: Tokyo Big Sight
Booth Number: F-11
Enhancing productivity and contributing to improved operational efficiency!
We will showcase products that can be used for the storage, transportation, protection, and retention of a variety of semiconductor/electronic components, precision parts, jigs, and tools.
We will respond to a wide range of requests from research/development/evaluation departments to manufacturing/inspection processes and shipping.
As a new product, we will display highly adhesive related products that make it easy to pick up (remove mounted items) for the transportation of fragile materials and ultra-thin precision parts, as well as wafer cases that enable the transportation of ultra-thin wafers through a unique cushioning mechanism.


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