Notice of participation in the Kansai Logistics Exhibition (held in Osaka) from April 12 (Wednesday) to April 14 (Friday), 2023.

The Quick Lock bundler immediately solves issues such as labor shortages and inefficiencies! Adopted for various types of fruits and vegetables.

Here is a proposal to improve bundling work efficiency using the Quick Lock bundling machine. To those in charge of produce packaging, are you facing issues such as labor shortages, heavy workloads, inefficiency, long working hours, and rising labor costs? The "865AC Automatic Bundling Machine System" allows for easy bundling by simply placing the packaged products. The bundling machine has a capacity of 80 shots per minute (MAX) and has been used for various types of produce including carrots, eggplants, and burdock. 【Specifications of the 865AC Automatic Bundling Machine System】 ■ Bundling machine capacity: 80 shots per minute (MAX) ■ System contents (Power supply: Three-phase 200V) - Includes 1082 model bag tensioner frame - Bag suction fan - Conveyor with slats *For more details, please refer to the PDF document or feel free to contact us. Additionally, we also offer the "088A Semi-Automatic Bundling Machine System," which is suitable for bundling a variety of products.

• Packaging Machines

By attaching it to bags of food containing multiple items, the convenience of your products will be enhanced, and it will also help reduce food waste.

The familiar fastener for bread bags, the "Bag Closure," allows for multiple openings and closings. *While it may be strongly associated with "something that secures bread bags," it is actively used in various fields such as vegetables, fruits, noodles, and processed foods. **Benefits for Food Companies** Using machines to quickly carry out bag sealing operations improves operational efficiency and reduces burdens. **Benefits for Consumers** It is convenient for storing food that cannot be consumed in one sitting, as it allows for easy opening and closing of bags, helping to reduce food waste. Closures are attached to bags by food companies and passed on to consumers. The closures are shipped in rolls, and when set in a dedicated sealing machine, sealing can be done smoothly at high speed. *It is also possible to manually cut and secure the bags without using a sealing machine. We offer a wide variety of sizes and colors. *Environmentally friendly products are also available. We will propose closures and sealing machines that meet your needs according to the type of bag, size, product weight, and packaging line layout.

• others

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!