Notice of Participation in Kansai Logistics Expo 2023 (April 12-14, Intex Osaka)

Automatically create loading plans that minimize dead space. Presentation of materials introducing features and improvement examples. Trial version available.

"Banning Master" is a system that visualizes cargo based on size information and creates loading plans considering weight balance, constraints, and workability. It optimizes loading efficiency for containers, trucks, pallets, etc., and can flexibly respond to additions or cancellations of cargo. It can also be used to identify bottlenecks and continuously improve loading efficiency. We offer a "software version" that can be tailored to your business needs and a "cloud version" that requires no installation. 【Features】 ■ Automatically calculates and visualizes highly efficient loading plans ■ Properly calculates the center of gravity, preventing cargo shifts and contributing to improved transport quality ■ Many successful implementations in automotive parts, electronics, food, and building materials manufacturers ■ Capable of providing algorithms that consider loading rules ★ We are currently offering materials that include examples of improvements in import and export of goods. You can view them immediately via "PDF Download." * A trial version of the cloud version (10 days) is also available. Please contact us for more details.

• Other Software
• Logistics and warehouse management systems

Calculate the size of cardboard boxes that perfectly fit the product to reduce shipping costs. An example of a reduction of 2.5 million yen per month.

The "Optimal Box Proposal Engine" is software that analyzes the size information of shipped products and cardboard boxes to calculate the minimum size of cardboard boxes that fit the product size. By minimizing the total length of the three dimensions (length, width, height) that affect shipping costs, it enables the reduction of shipping and material costs. Regular analysis also helps prepare appropriate cardboard boxes in line with the transition to new products. 【Features】 ■ Calculates the reduction rate of shipping costs compared to using the original box ■ There are cases where shipping costs were reduced by approximately 2.5 million yen Since actual data on shipped products is required, this is proposed in conjunction with the packaging box selection engine (BOX Engine). * Packaging box selection engine: https://www.vanning-master.jp/vm_cb01.html * For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

• Scientific Calculation and Simulation Software
• Other Software

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!