[Exhibition Participation Announcement] We will be exhibiting at the 37th NEPCON Japan - Electronics Development and Manufacturing Expo.

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We are releasing the UHF version of the HF shelf antenna, which has a sales record of over 2,000 units!

This is a shelf antenna system operating in the UHF band (920MHz). It allows for the bulk reading of books and equipment located on the shelf. By placing items with RF tags on the shelf antenna, it can be utilized for location management, inventory status tracking, and recording check-out and return histories. *UHF band RFID: Frequency 920MHz, International standard ISO/IEC18000-63, compliant with GS1 EPCglobal Gen2. Features: 1. UHF band RFID compliant with ISO/IEC 18000-63 and GS1 EPCglobal Gen2. 2. Type of specific low-power radio station that does not require a license application (output below 250mW). 3. One reader/writer can control up to 8 shelf antennas. 4. Location management for each shelf is possible. 5. Suppresses the spread of radio waves around the antenna to prevent misreads. 6. Installation on metal shelves is also acceptable. 7. Middleware for constant monitoring is available (sold separately). (*Direct control from the upper system without using middleware is also possible.) 8. The middleware includes a dashboard function bundled as a sample application.

• RFID/IC tags

You can easily implement inventory inspection for inbound and outbound processes using RFID.

This is a bulk check-in and check-out system for containers utilizing a radio wave shielding gate, using our company's UHF band RFID software package. The aluminum frame of the radio wave shielding gate is made from commercially available materials, achieving a cost approximately one-tenth that of a typical RFID gate. It is easy to install and move, making it applicable in various fields such as logistics, healthcare, manufacturing, and apparel. By attaching IC tags to the items being managed, check-in, check-out, and inventory record collection are realized using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer's side. 【Features】 ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of check-in, check-out, and inventory tasks. Additionally, operations can be tailored to the customer's environment and business, whether using handheld devices or gates. ■ IC Tag Issuance The package also includes an IC tag issuance function using an RFID-compatible label printer. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with Higher-Level Systems It integrates with higher-level systems via API or CSV, allowing for the RFID system to be implemented with a plug-in feel.

• Warehouse Management System (WMS)

Easily achieve constant monitoring with RFID! It enables real-time understanding of the inventory status and movement of managed items.

This is middleware for easily implementing a "constant monitoring RFID system" that automatically acquires the inventory and movement status of managed items. ■ Advanced Event Processing It processes the read IC tag data and databases the "inventory information" and "movement information" necessary for constant monitoring. ■ Easy Data Utilization The collected information is stored in a database, allowing users to easily access the necessary information whenever needed. (Database: PostgreSQL) ■ Centralized Management of Reader/Writers It supports multiple readers and multiple antennas, centrally managing various settings related to the reader/writer. The configuration of the readers and reading settings can also be easily performed from the screen.

• RFID/IC tags

The existing system remains unchanged! You can easily implement inventory inspection for inbound and outbound using RFID.

Attach IC tags to managed items and realize the collection of inbound and outbound inventory data using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer side. It integrates with upper systems via CSV or API, allowing for the introduction of RFID into existing WMS or core systems in a plug-in manner. This is a simple and easy-to-understand package specifically designed for RFID data collection. **Features** ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of inbound and outbound inventory operations. Additionally, operations can be tailored to the customer's environment and business needs, whether using handheld devices or gates. ■ IC Tag Issuance The package includes an IC tag issuance function using RFID-compatible label printers. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with Upper Systems It integrates with upper systems via API or CSV. Existing systems can remain unchanged while introducing the RFID system in a plug-in manner.

• Warehouse Management System (WMS)

The LF band (134.2 kHz) is an RFID system based on electromagnetic induction.

It is widely used for applications such as livestock and pet IDs, as well as semiconductor factories. We offer both built-in antenna stationary types and external antenna types. ーーーーーーーーーーーーーーーーーーーーーーーー More detailed information is available on the official website. Please be sure to check the link below. ーーーーーーーーーーーーーーーーーーーーーーーー

• RFID/IC tags

Reader/writer with touch panel that does not require a PC.

【Features】 　Built-in antenna 　LCD display with 2.8 inches (320×240d) touch functionality 　Standalone operation, no PC installation required 　Customizable touch panel display functionality 　Direct control of the reader/writer from a browser using web server functionality 　Supports MQTT as well

• RFID/IC tags

In the age of AI, how should we consider "human involvement" in BtoB marketing? As the utilization of AI accelerates, "human involvement" is being questioned again as a key factor influencing the results of BtoB marketing. Now, with the advancement of automation in information gathering and the sophistication of content generation, what customers expect from companies is not just efficiency, but an "experience" that includes a sense of satisfaction and trust. In this seminar, we will organize the concepts of "customer experience" design that marketing professionals should focus on by 2026 from 12 perspectives, including webinars, marketing automation, content, video, data utilization, and sales collaboration. We will consider what roles humans should play in the age of AI and how to design experiential value in the field of BtoB marketing.

In 2026, we will reach the halfway point. In the world of B2B marketing, due to further updates in AI and the deepening of cookie regulations, we have entered a phase where traditional "wait-and-see" strategies are becoming less effective in achieving results. Many of you may be considering what is necessary to ensure lead acquisition and maximize deal creation in the second half of the year amidst fierce competition. In this webinar, four leading companies in B2B marketing will come together. While unraveling the latest market trends, we will provide answers to pressing questions faced by the field, such as "Which channels should we really invest in now?", "What kind of content will be favored in the AI era?", and "What is the optimal solution for efficient nurturing?", along with practical methods. By combining the expertise of each company, we will present a concrete roadmap to accelerate your company's growth in the latter half of 2026.

"Since entering 2025, it has become clear that the number of visitors to our website has decreased..." "With the emergence of generative AI, I am anxious about how the product consideration process will change in the future..." Many marketing professionals share this sense of crisis. The traditional approach of "SEO that targets keywords to improve rankings" can no longer compete in the current search environment where AI selects and filters information. This is where AIO (AI Optimization) is gaining attention. However, the reality remains unclear: "I hear the term, but what exactly should I do?" and "How is it different from SEO?" In this webinar, Shannon, a marketing automation vendor that has felt a sense of crisis regarding the "evaluation from AI" of its own site and has boldly implemented structural reforms, will share specific steps to "correctly teach AI about our company and position ourselves as a candidate for comparison," along with actual stories of failures, in collaboration with LANY, a pioneer in AIO/SEO, and GIG, a group of specialists in information design.

In the sales promotion of contract development and SI business, the biggest opportunity loss may be "the consideration period is too long, leading to not being recalled at the timing of replacement." The thousands of business cards acquired at trade shows, and the logs of "lost opportunities and halted considerations" accumulated in the SFA. These are originally "assets" that could transform into projects worth tens of millions to hundreds of millions of yen. However, on-site sales (or sales engineers) are overwhelmed by immediate projects, making it physically impossible to pursue leads from several years ago. In this webinar, we will present a system for generating business negotiations from dormant customers using MA, based on the premise of the unique limitations of SIers that "cannot follow up on everything."

Bosch Engineering Co., Ltd. will be exhibiting at the International Construction and Surveying Exhibition (CSPI-EXPO2026) held at Makuhari Messe. At this exhibition, in addition to showcasing off-road products such as radar and ultrasonic sensors, we will also introduce the actual operation of various sensors using demonstration units as case studies. We understand you may be busy, but we sincerely look forward to your visit. Exhibition Highlights (Booth Numbers: 23-17 & 23-11) ▶ Off-road environmental recognition technology ▶ Demonstration of various products Product and Technology PR Seminars 6/18 10:30~11:00 Seminar Room III 6/19 10:30~11:00 Seminar Room III 【Parts and engineering services for construction machinery, from sample supply to mass production】 ▶ About Bosch Engineering and the off-road business ▶ About off-road products such as ultrasonic sensors, radar, and cameras