[Exhibition Participation Announcement] We will be exhibiting at the 37th NEPCON Japan - Electronics Development and Manufacturing Expo.

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We are releasing the UHF version of the HF shelf antenna, which has a sales record of over 2,000 units!

This is a shelf antenna system operating in the UHF band (920MHz). It allows for the bulk reading of books and equipment located on the shelf. By placing items with RF tags on the shelf antenna, it can be utilized for location management, inventory status tracking, and recording check-out and return histories. *UHF band RFID: Frequency 920MHz, International standard ISO/IEC18000-63, compliant with GS1 EPCglobal Gen2. Features: 1. UHF band RFID compliant with ISO/IEC 18000-63 and GS1 EPCglobal Gen2. 2. Type of specific low-power radio station that does not require a license application (output below 250mW). 3. One reader/writer can control up to 8 shelf antennas. 4. Location management for each shelf is possible. 5. Suppresses the spread of radio waves around the antenna to prevent misreads. 6. Installation on metal shelves is also acceptable. 7. Middleware for constant monitoring is available (sold separately). (*Direct control from the upper system without using middleware is also possible.) 8. The middleware includes a dashboard function bundled as a sample application.

• RFID/IC tags

You can easily implement inventory inspection for inbound and outbound processes using RFID.

This is a bulk check-in and check-out system for containers utilizing a radio wave shielding gate, using our company's UHF band RFID software package. The aluminum frame of the radio wave shielding gate is made from commercially available materials, achieving a cost approximately one-tenth that of a typical RFID gate. It is easy to install and move, making it applicable in various fields such as logistics, healthcare, manufacturing, and apparel. By attaching IC tags to the items being managed, check-in, check-out, and inventory record collection are realized using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer's side. 【Features】 ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of check-in, check-out, and inventory tasks. Additionally, operations can be tailored to the customer's environment and business, whether using handheld devices or gates. ■ IC Tag Issuance The package also includes an IC tag issuance function using an RFID-compatible label printer. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with Higher-Level Systems It integrates with higher-level systems via API or CSV, allowing for the RFID system to be implemented with a plug-in feel.

• Warehouse Management System (WMS)

Easily achieve constant monitoring with RFID! It enables real-time understanding of the inventory status and movement of managed items.

This is middleware for easily implementing a "constant monitoring RFID system" that automatically acquires the inventory and movement status of managed items. ■ Advanced Event Processing It processes the read IC tag data and databases the "inventory information" and "movement information" necessary for constant monitoring. ■ Easy Data Utilization The collected information is stored in a database, allowing users to easily access the necessary information whenever needed. (Database: PostgreSQL) ■ Centralized Management of Reader/Writers It supports multiple readers and multiple antennas, centrally managing various settings related to the reader/writer. The configuration of the readers and reading settings can also be easily performed from the screen.

• RFID/IC tags

The existing system remains unchanged! You can easily implement inventory inspection for inbound and outbound using RFID.

Attach IC tags to managed items and realize the collection of inbound and outbound inventory data using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer side. It integrates with upper systems via CSV or API, allowing for the introduction of RFID into existing WMS or core systems in a plug-in manner. This is a simple and easy-to-understand package specifically designed for RFID data collection. **Features** ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of inbound and outbound inventory operations. Additionally, operations can be tailored to the customer's environment and business needs, whether using handheld devices or gates. ■ IC Tag Issuance The package includes an IC tag issuance function using RFID-compatible label printers. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with Upper Systems It integrates with upper systems via API or CSV. Existing systems can remain unchanged while introducing the RFID system in a plug-in manner.

• Warehouse Management System (WMS)

The LF band (134.2 kHz) is an RFID system based on electromagnetic induction.

It is widely used for applications such as livestock and pet IDs, as well as semiconductor factories. We offer both built-in antenna stationary types and external antenna types. ーーーーーーーーーーーーーーーーーーーーーーーー More detailed information is available on the official website. Please be sure to check the link below. ーーーーーーーーーーーーーーーーーーーーーーーー

• RFID/IC tags

Reader/writer with touch panel that does not require a PC.

【Features】 　Built-in antenna 　LCD display with 2.8 inches (320×240d) touch functionality 　Standalone operation, no PC installation required 　Customizable touch panel display functionality 　Direct control of the reader/writer from a browser using web server functionality 　Supports MQTT as well

• RFID/IC tags

We will be exhibiting at the "Financial International Information Technology Exhibition" FIT Osaka 2026, which will be held at Grand Front Osaka on September 3 (Thursday) and September 4 (Friday). We will introduce the features of our human resources information system "Fellowship," which includes various functions useful for HR department operations, such as personnel management, payroll, and employment.

Our company will invite professors who are active at the forefront of university research to hold a web technology course in the construction field. This time, as a follow-up to "The Effects and Design Considerations of Shield Tunnels in Proximity and Adjacent Situations - Part 1," which was published in July, we will have a lecture by Professor Noriyuki Horiuchi from Kokushikan University. In "Part 1," we explained the phenomena of the effects caused by proximity and adjacent shield tunnels, using examples of left-right adjacency and passing beneath existing tunnels, as well as the basic concepts of numerical evaluation. In "Part 2," we will focus on the vertical adjacency of large-section shields. We will introduce analytical methods for numerically evaluating the impact on existing tunnels, surrounding ground, and existing underground structures, using actual site measurement data and FEM sequential excavation analysis, specifically in cases where large-section shields are constructed above or below existing tunnels. We will also discuss methods for predictive analysis, design, and construction considerations. This course will be beneficial for those studying for the "Professional Engineer Examination," so please take this opportunity to participate. Additionally, this course is a CPD accredited program by the Japan Society of Civil Engineers (planned), and you can also participate as part of engineer education. We sincerely look forward to your participation.

In this webinar, we will clearly explain effective operational methods based on media characteristics, timing for posting, and points for improvement after publication. It is not only important to "collect applications" in recruitment. To prevent mismatches and early turnover after hiring, it is crucial to review the entire recruitment process, including how job information is conveyed and what to confirm during the selection process. Therefore, we will also introduce how to design the recruitment process to prevent discrepancies in understanding with job seekers and to enhance retention rates. Additionally, in small and medium-sized enterprises with few recruitment personnel, the workload involved in creating job postings, responding to applicants, and measuring effectiveness can become a significant burden. We will also explain how to systematize and streamline media operations to make recruitment tasks more efficient, allowing continuous recruitment activities even with limited personnel. Finally, based on the content introduced this time, we will organize and convey specific improvement actions that can be implemented starting tomorrow. Even companies that find it difficult to increase their recruitment budget may have the potential to enhance recruitment outcomes by reviewing their choice of job media, job postings, operational methods, and recruitment processes.

Our company will be exhibiting at the on-site DX EXPO【Autumn】held at Makuhari Messe, in collaboration with Japan Comsys Corporation, TOSYS Corporation, NDS Corporation, and Tomei Communication Industry Corporation, as part of the Comsys Group. This exhibition is held within the "Japan DX & AX Week" and is a specialized exhibition where the latest solutions supporting digital transformation (DX) such as image processing AI, remote monitoring, and robotics gather for those working in various fields such as construction sites and factories. We will also be introducing various AI-powered solutions from our company. Exhibited Products: - Collaborative solutions from various companies (AIJO Site Monitor 'Bear Detection Solution') - AI rebar shape measurement system 'AIJO Rebar King -AIJO HiKing-' - AI monitoring solution 'AIJO Site Monitor' - Safety gear inspection before work 'AIJO Safety' - Product appearance inspection solution for manufacturing industry 'AIJO Check AItem' - Automated drone inspection service for solar power plants 'AIJO Check Solar' and more.

JMP is software that not only excels in statistical analysis and graph creation but also has robust features for experimental design. By utilizing experimental design, efficient data collection can be achieved while minimizing time and costs. In this seminar, we will focus on the features of experimental design, specifically the sample size explorer and Bayesian optimization, and demonstrate examples of their application in the manufacturing industry. 【Overview】 First half: Utilization of t-tests in the manufacturing industry and simulation of required data numbers We will explain the overview and examples of t-tests, which are used for various purposes in the manufacturing industry, and present analysis examples using JMP. Additionally, we will introduce a method to simulate the relationship between the required data numbers for t-tests and statistical power using the sample size explorer. Second half: How to utilize JMP Pro Bayesian optimization – Application to simulation experimental data The Bayesian optimization platform is originally designed for experimental data that includes measurement errors, but there is also a strong demand to apply it to simulation experimental data that does not contain errors, such as CAE. In this seminar, we will introduce approaches for utilizing Bayesian optimization with simulation experimental data.