Solubilizer - Company Ranking(6 companies in total)

Last Updated: Aggregation Period:Jun 03, 2026〜Jun 30, 2026
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
【Properties and Components】 Appearance: Colorless and transparent to slightly pale yellow Boiling point: Approximately 58℃ Specific gravity:... 【Main Uses】 ▶ Dissolving and bonding various resins ▶ Rework, component recovery ▶ Analysis and examination ▶ Weight reduction through resin...
- Specific gravity: Approximately 1.15 (25°C) - Boiling point: Approximately 120°C - KB value: 130 or higher - Appearance: Colorless and tra... Dissolution, swelling, peeling, and alternative to fuming nitric acid of solid substances after curing epoxy resin. *Please perform immers...
【Product Lineup】 'eSolve 21HUK' For dissolving, swelling, and peeling before and after curing of urethane resin, and for dissolving polyc... 【Main Uses】 ◎ Dissolution and peeling of epoxy resin on substrates ◎ Opening of substrate sealants (good product analysis and defect analysi...
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  1. Featured Products
    [New Product] PET Resin and Polyamide Resin Solvent eSolve 21FP-5[New Product] PET Resin and Polyamide Resin Solvent eSolve 21FP-5
    overview
    【Properties and Components】 Appearance: Colorless and transparent to slightly pale yellow Boiling point: Approximately 58℃ Specific gravity:...
    Application/Performance example
    【Main Uses】 ▶ Dissolving and bonding various resins ▶ Rework, component recovery ▶ Analysis and examination ▶ Weight reduction through resin...
    Post-cured epoxy solvent "eSolv 21HEK" (non-flammable)Post-cured epoxy solvent "eSolv 21HEK" (non-flammable)
    overview
    - Specific gravity: Approximately 1.15 (25°C) - Boiling point: Approximately 120°C - KB value: 130 or higher - Appearance: Colorless and tra...
    Application/Performance example
    Dissolution, swelling, peeling, and alternative to fuming nitric acid of solid substances after curing epoxy resin. *Please perform immers...
    Epoxy resin solvent "eSolv 21HEK"Epoxy resin solvent "eSolv 21HEK"
    overview
    【Product Lineup】 'eSolve 21HUK' For dissolving, swelling, and peeling before and after curing of urethane resin, and for dissolving polyc...
    Application/Performance example
    【Main Uses】 ◎ Dissolution and peeling of epoxy resin on substrates ◎ Opening of substrate sealants (good product analysis and defect analysi...