富士高分子工業 List of News Articles

We will be conducting a demonstration of the automatic implementation of heat dissipation sheets. We invite you to visit and see the automatic implementation of ultra-low hardness sheets. We look forward to your attendance. Our booth location is [East Exhibition Hall E48-32].

The "waveSTRATE 26LB" incorporates ceramic powder into fluororesin to provide the necessary functions required for substrate materials. It achieves a dielectric constant of 2.60, ultra-low Tanδ, and high peel strength using low roughness copper foil, which is said to be difficult to bond with fluororesin layers. The coefficient of thermal expansion is also kept low, minimizing dimensional changes at high temperatures, making it suitable for high-frequency antennas in the millimeter wave band and substrate materials for high-speed transmission. Due to the absence of glass cloth, it offers flexibility and can be used similarly to flexible printed circuits (FPC). Additionally, the "wave STRATE 49TA" is also available, which features a thermal conductivity of 2 W/m·K in the insulation layer. The "Electromagnetic Wave Suppression Thermal Conductive Sheet" is a silicone sheet with low hardness and slight tackiness, allowing it to be placed between heat-generating elements that emit noise and heat sinks, enabling simultaneous noise and heat mitigation. It is finished as a product with an extremely low content of low molecular siloxanes.

In addition to the existing Sacon series, we will showcase high thermal conductivity products and new developments. The event will be held at Tokyo Big Sight from July 24 to 26, 2024.