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アイテス

EstablishmentJanuary 1, 1993
capital3000Ten thousand
number of employees106
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
last updated：
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アイテス List of Catalogs

136～180 item / All 360 items

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Example of EPMA analysis using the guide net map method.

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LCD Panel Analysis Data Collection

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Case Study of Foreign Matter Analysis in Laminating Film

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Case study of fisheye analysis of laminate film.

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Evaluation of TFT characteristics of liquid crystal panels

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[Information] Mass Spectrometry Guide

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Color evaluation of paint using a colorimeter.

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Observation of the coating film

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Evaluation of distortion and birefringence in plastic molded products.

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FT-IR analysis of ABS resin

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Ion Chromatography Analysis Case (Solid Surface)

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Evaluation of material properties using a ultra-micro hardness tester.

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Measurement of solder crack rate by cross-sectional observation.

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Oblique CT observation of the laminated substrate.

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FT-IR analysis of polyethylene

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Evaluation of distortion and birefringence of products/materials by WPA.

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Observation of diamond clarity

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X-ray observation of electrolytic capacitors

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[Example of TOF-SIMS] Analysis of Li

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Identification of failure locations in electronic components through thermal analysis.

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Structural analysis of Nylon 6.10

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Analysis of pigments and polymers using MALDI-TOFMS.

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[Data] We will solve the cause of the issue from a chemical perspective.

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[Data] IR Analysis of Vinyl Polymers (Resin Materials)

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Simple measurement of band gap using XPS.

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Authenticity investigation (comparative observation)

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[Data] Degradation Analysis of Polarizing Film and Light Diffusing Film

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[Data] FT-IR Analysis of Transparent Resin

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Analysis of polymerization initiators in light-curing resins.

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[Data] Structural Analysis of MEMS Components

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[Data] EPMA Analysis Example 2

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Surface Analysis Guide

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Surface analysis of discolored and altered materials using XPS (ESCA).

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[Example of analysis using EBSD] Silicon wafer

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FE-SEM observation (Crystal grain observation of Al wire bonding section)

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Evaluation of BGA and CSP solder.

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We provide support from reliability testing of materials to chemical analysis.

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Melt Flow Rate (MFR) Measurement Evaluation Service

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Regarding the curing temperature of epoxy resin during sample encapsulation.

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Cross-sectional observation by SEM: Connector plating

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[Data] Analysis of SEG-LCD Panel Display Malfunctions

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[Data] ICP Emission Spectroscopy Analysis (ICP-AES)

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[Data] Colorimetric evaluation of resin color systems and transmittance using a color difference meter.

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[Information] Whisker Observation - Tips for Observing Flat Whiskers

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[Data] Example of EPMA Analysis

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