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We would like to introduce the "industrial felt" handled by Ichikawa Techno Fabrics Co., Ltd. We offer a variety of high-performance products, including high heat-resistant felt (over 500°C). With the three main keywords of "cushioning," "transportation," and "protection/covers," our products are active in various manufacturing sites such as the printed circuit board industry, aluminum extrusion industry, and steelmaking industry. Please feel free to consult us when you need our services. 【Features】 ■ Cushioning material for high-temperature press molding and lamination ■ Compatible with high-speed communication standards (5G) ■ Low dielectric constant substrates ■ Film lamination ■ Attachment of dissimilar materials *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationThe "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses the dual properties of cushioning and thermal conductivity. It can be used at press temperatures of 300°C to 500°C or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650°C. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning and thermal conductivity ■ Usable at press temperatures of 300°C to 500°C or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationThe "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It has the properties of both cushioning and thermal conductivity, making it reusable. You can select an appropriate cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationThe "ACE BOARD X・CX Series" is a cushioning material for printed circuit board manufacturing that combines cushioning properties with thermal conductivity. It is suitable for automatic transport through adhesion and can be used at press temperatures of 200°C to 300°C. Additionally, it can be reused multiple times. You can select the appropriate cushioning material, so please feel free to consult us when needed. 【Features】 ■ Combines cushioning properties with thermal conductivity ■ Usable at press temperatures of 200°C to 300°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registration"Felt for Steel Plates" is a product designed to prevent damage when heated steel plates, which are still at temperatures around 250-350°C, pass through rolls. Due to the risk of scratching from contact with the rolls, a cover is placed on the roll surface. The felt is placed over the roll and secured by folding and fixing both ends. Increasingly, high heat-resistant and high-strength poly(p-phenylene benzobisoxazole) (PBO) fibers are being used in the crown area. 【Specifications Example】 ■ Roll Dimensions: φ1500mm × L2100mm ■ Material: PBO / Para-Aramid ■ Crown Thickness × Width: 5.0mm × 1800mm *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registration"THERMOTEX(R)" is a heat-resistant felt that helps prevent scratches on delicate aluminum extrusions. Aluminum extrusions gradually cool down from the initial table, through the run-out table, to the cooling table and sorting table, so we offer a lineup of felts made from various types of fibers tailored to the temperature and transport conditions of the aluminum extrusions. [Product Forms] ■ Tube ■ Endless Belt ■ Pad *For more details, please download the PDF or feel free to contact us.
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Free membership registration"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made of high heat-resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases *For more details, please download the PDF or contact us.
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