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Tohoku Techno Arch Co., Ltd.

addressMiyagi/Aoba-ku, Sendai-shi/6-6-10 Aobayama, 2nd floor, Tohoku University Center for Advanced Future Science and Technology Research
phone022-222-3049
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Tohoku Techno Arch Co., Ltd. List of Catalogs

91～135 item / All 396 items

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Tohoku Univ. Technology : Nucleic acid molecules that increase insulin-secreting beta cells : T14-170

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Tohoku Univ. Technology : HEAT STORAGE MATERIAL AND METHOD FOR USING HEAT ENERGY : T21-164

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Tohoku Univ. Technology : Tin Iodide Perovskite Thin Film : T24-077

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Hokkaido Univ. Technology : Optical antenna: HK24-018

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Tohoku Univ. Technology : Soil estimation method : T24-070

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Tohoku Univ. Technology : Aspergillus oryzae introduced with multi-copy genes : T24-084

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Tohoku Univ. Technology : A novel mitochondrial oxidative stress marker: T24-075

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Tohoku Univ. Technology: Assessment tool for circadian rhythm sleep-wake disorder: T23-062

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Tohoku Univ. Technology: Small molecule inhibitors of Vasohibin-2 : T23-047

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Tohoku Univ. Technology : Distributed curvature crystal lens and X-ray reflectance measurement device : T07-098

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Tohoku Univ. Technology: A Nonvolatile Register with a Differential Information Storing Scheme: T24-080

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Tohoku Univ. Technology: A Nonvolatile Register with a Reference Load Sharing Scheme: T24-081

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Tohoku Univ. Technology：13C Immobilized Reagent：T23-086

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Tohoku Univ. Technology : Hue specific superposition marker：T24-097

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Tohoku Univ. Technology: Biophotoacoustic spectroscopy system: T21-342

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Tohoku Univ. Technology:Highly Dispersible Filamentous Fungi with Reduced Hypoxia and Viscosity in Culture : T24-082

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Tohoku Univ. Technology: Highly Dispersible Filamentous Fungi with Reduced Adhesion and Aggregation to Culture Tank Equipment : T23-061

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Tohoku Univ.Technology : Method for producing microorganism carrier : T24-062

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Tohoku Univ.Technology : Piezoelectric thin film & Piezoelectric device : T17-157

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Tohoku Univ. Technology :The Process of Copper Electrorefining : T23-082

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Tohoku Univ. Technology : Diaper Sensor: T24-065

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Tohoku Univ. Technology : Aluminum recycling technology : T21-372

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Hokkaido Univ. Technology : The most Advanced Analog RoF technology of Beyond 5G (6G) : HK24-009

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Hokkaido Univ. Technology : Electrode and control method of Overvoltage : HK24-016

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Tohoku Univ. Technology　: Estimation method of grain size of crushed stone: T24-032

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Hokkaido Univ. Technology :High-sensitivity single-sided pressure sensor with depth detection：HK24-002

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Tohoku Univ. Technology : Room temperature wafer bonding : T24-033

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Tohoku Univ. Technology : Device to measure nanoparticle distribution: T24-030

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Tohoku Univ. Technology : Multilayer structure and its manufacturing method : T24-027

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Tohoku Univ. Technology : Method for producing spherical zinc oxide : T19-905

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Hokkaido Univ. Technology : Bio-Catalytic Approach to Mesoscopic Particle Synthesis : HK24-007

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Tohoku Univ. Technology : Batch fabrication method by laminating method : T24-029

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Hokkaido Univ. Technology: Light-driven actuator：HK24-010_HK24-015

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Hokkaido Univ. Technology : Molded body and method for producing Polymer Crosslinked body : HK24-012

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Tohoku Univ/Tohoku Institute of Technology :Transducer, Force Sensor and Sensor Unit: T21-171

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Tohoku Univ. Technology:Dinitrogen pentoxide generator: T20-332_T21-149

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Tohoku Univ. Technology :Intestinal bacteria that reduce uremic substances : T22-046

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Tohoku Univ. Technology : Titanium ion redox flow battery : T21-163

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Tohoku Univ. Technology : New Pearlescent Pearl pigment : T24-003

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Tohoku Univ. Technology : ADVANCED TACTILE SENSOR SYSTEM : T19-890

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Tohoku Univ. Technology : Method for producing tertiary alcohol : T22-005

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Tohoku Univ. Technology : Carbon recovery from dry smelting flue gases : T21-205

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Hirosaki Univ. Technology : Thin and flexible force sensor Related patents (1/4): K23-011_K23-022_K23-030_K24-002

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Hirosaki Univ. Technology : Reliability evaluation method of Multilayer wiring : K23-014

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Hirosaki Univ. Technology : Method for improving thermoelectric power of thermoelectric semiconductor : K23-013

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