Building materials, supplies and fixtures manufacturers

小平製作所

addressTokyo/Bunkyo-ku/Nedzu 2-35-11
phone3828-5851
last updated：
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Pressure Multi-Stage Hot Press Lamination Press Model PL-80

High-rigidity multi-stage press for cover film lamination

This is a model suitable for small-batch production of various types, featuring a high-rigidity multi-stage press for bonding cover films of flexible printed circuit boards (FPC).

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