Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"
The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.
The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses the dual properties of cushioning and thermal conductivity. It can be used at press temperatures of 300°C to 500°C or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650°C. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning and thermal conductivity ■ Usable at press temperatures of 300°C to 500°C or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.
- Company:イチカワテクノファブリクス
- Price:Other