Diamond powder for wire with strong grinding power, dispersibility, and wear resistance.
Regularly structured crystals with a concentrated particle size distribution, spherical shape, and extremely few surface impurities possess strong grinding power, dispersibility, and wear resistance. They are suitable for processing, cutting, and lapping organic and inorganic brittle materials. Additionally, they can be applied to diamond wires, diamond ropes, gemstone saws, semiconductor saws, and other high-tech materials such as single crystal silicon, diamond, sapphire, quartz, optical instruments, LED cold light, high-precision magnetic materials, and semiconductors for cutting, fine polishing, and lapping.