TTV supports up to 0.5μm! The ideal glass wafer for manufacturing sensor formation substrates!
Mitsuru Optical Research Institute handles "glass wafers" compatible with TTV up to 1μm.
These are ideal for applications such as interposers and other structures, back-grind processing supports, and sensor formation substrates.
We accommodate various glass materials including quartz, soda-lime glass, and low-alkali glass.
【Specifications】
■ Compatible sizes: 2 inch, 4 inch, 6 inch, 8 inch, 12 inch, maximum φ500
■ Wafer thickness: 0.3mm to 15mm
■ TTV (Total Thickness Variation)
・Thickness variation across the entire wafer: within 0.5μm
■ Edge finishing: Chamfering, rounding, and mirror finishing are also possible.
*For more details, please feel free to contact us.