Release Agent No. 10
Liquid fluorine-based release agent for mold making and epoxy resin adhesion prevention.
We would like to introduce our "Release Agent No.10." It is used for applications such as releasing from epoxy surfaces, wood patterns, acrylic models, and polyester/urethane surfaces. Additionally, it can be used to prevent adhesion with FRP, glass, stone, and to improve the efficiency of cutting and trimming tasks with scissors and cutters. 【Usage Instructions】 ■ Apply with a soft brush. ■ Be sure to apply two coats, and after application, lightly wipe with a cloth. ■ When removing, wipe thoroughly with alcohol or warm water. ■ Can be used without air drying after application. ■ The thickness of the release layer is approximately 0.1 to 1 micron or less. *For more details, please refer to the PDF document or feel free to contact us.
- Company:アール・イー・ティー
- Price:More than 100million yen