[Available for preview] ~ Substrate, Joining, Sealing, Cooling Technologies ~
Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Countermeasures
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◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples!
◎ Detailed guidelines for designing TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"!
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■ This book includes the following information:
- Improving the heat resistance of resins and measures against material expansion
- Composite materials of thermally conductive fillers and resins
- Development trends of resin substrates, ceramic substrates, and metal substrate materials
- Countermeasures for failures such as warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients
- Response to high-temperature operation above 300°C and low-temperature operation below freezing
- Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability
- Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack countermeasures
- Suppression of electromigration and electrochemical migration
- Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials
- 企業:技術情報協会
- 価格:10,000 yen-100,000 yen