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[Application Case of System Analog Technology] LSI for Ultrasonic Diagnostic Equipment

Mass production for Japanese medical device manufacturers! A case where heat generation has been minimized to the extreme through ultra-low power consumption.

In the development of LSI for ultrasound diagnostic devices, we would like to introduce a case where our system analog technology was applied. The challenges were to control approximately 2000 transducers at a size that could fit into the esophagus and to minimize power consumption to prevent burns. To address this, we arranged the transmission and reception circuits connected to the ultrasound transducers (piezo elements) in an array configuration to achieve beamforming. This allowed us to suppress heat generation to an extreme low power consumption. 【Case Overview】 ■ Customer Challenges - Control approximately 2000 transducers at a size that can fit into the esophagus - Minimize power consumption to prevent burns ■ Achievements - Equipped with 1900 transceivers (transmission and reception circuits) in a size of approximately 10mm x 10mm - Incorporated beamforming functionality with a power consumption of 2W *For more details, please refer to the PDF document or feel free to contact us.

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LSI for wireless ultrasound diagnostic equipment

We are developing LSI that enables miniaturization and power saving of ultrasound diagnostic device probes!

The current wireless ultrasound diagnostic devices have challenges related to power consumption, size, and weight, which lead to issues with operability and shape limitations. Our analog LSI development technology for ultrasound has made it possible to significantly reduce power consumption while miniaturizing the probe. As a result, it can streamline the handling of the device and the charging process. [Main Features of the LSI] <LSI for Wireless Ultrasound Diagnostic Device MACADAMIA (Development Code Name)> ■ Incorporates numerous transmission and reception functions into a single chip ■ Suitable for compact handheld ultrasound systems ■ Utilizes CSP packaging ■ Miniaturized to 11.07mm × 12.65mm ■ Capable of meeting the stringent thermal design requirements of compact systems *For more details, please refer to the PDF document or feel free to contact us.

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