FPC(エッチング) - List of Manufacturers, Suppliers, Companies and Products

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Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.

We would like to introduce our achievements in substrate manufacturing. We optimized each device to handle materials in roll form and produced ultra-long substrates with a product size of 20m. We perform exposure, development, and etching processes, using polyester materials to reduce costs. We have achieved low-cost production through proposals during the manufacturing method and product design stages, as well as innovations in the manufacturing process. 【Basic Specifications】 ■ Material: Polyester / 0.075 Cu35 / 0μ ■ Processes: Etching, simple contour processing ■ Substrate Size: 20000×59 ■ Others: Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Digital Signage
  • Anemometer
  • Other PCs and OA equipment

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

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